Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462467 | Lead frame, package structure comprising the same and method for manufacturing the package structure | Chia-Hsiu Huang, Chun-Chen Chen, Wei Chih Cho, Shao-Lun Yang | 2022-10-04 |
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Ko-Pu WU +1 more | 2022-09-20 |
| 11139225 | Device including a plurality of leads surrounding a die paddle and method for manufacturing the same | Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen +1 more | 2021-10-05 |
| 10797004 | Semiconductor device package | Shao-Lun Yang, Chia-Yi Cheng, Hong Jie Chen, Shih-Yu Huang | 2020-10-06 |
| 10312198 | Semiconductor device package | Shao-Lun Yang, Chia-Yi Cheng, Hong Jie Chen, Shih-Yu Huang | 2019-06-04 |