Patents per Year
Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12074118 | Semiconductor device package and method for manufacturing the same | Chia-Hsiu Huang, Chun-Chen Chen, Shao-Lun Yang | 2024-08-27 | $9,141,000 |
| 12027467 | Semiconductor device package and method of manufacturing the same | Shao-Lun Yang, Chun-Hung Yeh, Tsung-Wei Lu | 2024-07-02 | $5,337,000 |
| 11908781 | Semiconductor device package and a method of manufacturing the same | Chun-Hung Yeh, Tsung-Wei Lu | 2024-02-20 | $2,961,000 |
| 11676912 | Semiconductor device package and method for manufacturing the same | Chia-Hsiu Huang, Chun-Chen Chen, Shao-Lun Yang | 2023-06-13 | $4,340,000 |
| 11462467 | Lead frame, package structure comprising the same and method for manufacturing the package structure | Chia-Hsiu Huang, Chun-Chen Chen, Shao-Lun Yang, Yu-Shun Hsieh | 2022-10-04 | $1,934,000 |
| 11443997 | Semiconductor package and method of manufacturing the same | Chun-Chen Chen, Shao-Lun Yang | 2022-09-13 | $2,922,000 |