Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh +1 more | 2022-09-20 | $5,990,000 |
| 11139225 | Device including a plurality of leads surrounding a die paddle and method for manufacturing the same | Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen +1 more | 2021-10-05 | $907,000 |