Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang | 2020-08-04 |
| 10629519 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang | 2020-04-21 |
| 10573624 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang | 2020-02-25 |
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang | 2019-03-05 |
| 10157887 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang | 2018-12-18 |
| 10134683 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang, Yu-Tzu Peng | 2018-11-20 |