| 12321513 |
Body-part tracking device and body-part tracking method |
Chi-Sheng Tseng, Lu-Ming Lai, I Hung Wu, Kai-Sheng PAI |
2025-06-03 |
|
| 12184266 |
Electronic package structure |
Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI |
2024-12-31 |
$1,714,000 |
| 11817397 |
Semiconductor device package |
Chi-Sheng Tseng, Lu-Ming Lai, Yu-Che Huang |
2023-11-14 |
$2,510,000 |
| 11588470 |
Semiconductor package structure and method of manufacturing the same |
Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI |
2023-02-21 |
$1,541,000 |
| 11527671 |
Optical package structure and method of manufacturing the same |
Chi-Sheng Tseng, Ching-Han Huang |
2022-12-13 |
$2,288,000 |
| 11296651 |
Semiconductor package structure |
Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI, Cheng-Ling Huang |
2022-04-05 |
$1,088,000 |
| 11217499 |
Semiconductor package structure and method for manufacturing the same |
Chi-Sheng Tseng, Lu-Ming Lai |
2022-01-04 |
$1,679,000 |
| 11088054 |
Lead frame and method for manufacturing the same |
Chi-Sheng Tseng, Lu-Ming Lai, Ying-Chung Chen |
2021-08-10 |
$2,631,000 |
| 10812017 |
Semiconductor package structure |
Chi-Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Kuo-Hua LAI, Cheng-Ling Huang |
2020-10-20 |
$1,701,000 |