Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7168352 | Process for sawing substrate strip | Jau-Yuen Su, Su Tao | 2007-01-30 |
| 6338813 | Molding method for BGA semiconductor chip package | Kao-Yu Hsu, Chun-Hung Lin | 2002-01-15 |
| 6316828 | Structure of a solder mask for the circuit module of a BGA substrate | Su Tao, Kao-Yu Hsu | 2001-11-13 |
| 6176417 | Ball bonding method on a chip | Yu-Fang Tsai, Su Tao, Simon Lee | 2001-01-23 |
| 5982625 | Semiconductor packaging device | Kun-Ching Chen, Yung-I Yeh, Wu Wang, Chun-Che Lee, Chun-Hsiung Huang +1 more | 1999-11-09 |