Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693142 | Housing of electronic device and speaker | FU-MING LIU | 2017-06-27 |
| 8256111 | Circuit board layout method | Yu-Hsu Lin, CHIH-HANG CHAO | 2012-09-04 |
| 8154125 | Chip package structure | — | 2012-04-10 |
| 8154879 | Motherboard | CHIH-HANG CHAO, Yu-Hsu Lin | 2012-04-10 |
| 8035034 | Printed circuit board | Yu-Hsu Lin, CHIH-HANG CHAO | 2011-10-11 |
| 7996169 | Method and apparatus for compensating S-parameters of passive circuits | Yu-Hsu Lin, CHIH-HANG CHAO | 2011-08-09 |
| 7973244 | Printed circuit board | Yu-Hsu Lin, Chan-Fei Tai, CHIH-HANG CHAO | 2011-07-05 |
| 7929304 | Heat dissipation apparatus | LIANG-LIANG CAO, Yang Li | 2011-04-19 |
| 7864536 | Circuit board assembly | Qin Li, Yu-Hsu Lin, CHIH-HANG CHAO | 2011-01-04 |
| 7835149 | Computer enclosure with airflow guide | Yang Li, Yu-Hsu Lin, Lei Guo, LIANG-LIANG CAO, Liang Shan | 2010-11-16 |
| 7763817 | Button assembly | ZHI-PING WU, CHIH-HANG CHAO, Yu-Hsu Lin | 2010-07-27 |
| 7760498 | Electronic apparatus with air guiding element | Liang Shan, Yang Li, Yu-Hsu Lin, LIANG-LIANG CAO, Lei Guo | 2010-07-20 |
| 7675753 | Mounting apparatus for heat sink | Yang Li, Yu-Hsu Lin | 2010-03-09 |
| 7663063 | Circuit board with improved ground plane | Yu-Hsu Lin, CHIH-HANG CHAO | 2010-02-16 |
| 7633169 | Chip package structure | — | 2009-12-15 |
| 7606119 | Objective lens actuator | CHIH-HANG CHAO, Yu-Hsu Lin, Chun-Ming Chen | 2009-10-20 |
| 7482204 | Chip packaging process | Chin-Li KAO, Yi-Shao Lai, Tong-Hong Wang | 2009-01-27 |
| 7451466 | Feeding mechanism for pickup head | CHIH-HANG CHAO, Yu-Hsu Lin | 2008-11-11 |
| 7447014 | Bracket assembly for disk drive and a method of assembling a bracket to an enclosure for preventing resonance | CHIH-HANG CHAO, Yu-Hsu Lin, ZHI-PING WU | 2008-11-04 |
| 7447039 | Motherboard configured to minimize or prevent damage to a chip thereon | CHIH-HANG CHAO, Yu-Hsu Lin | 2008-11-04 |
| 7407833 | Process for fabricating chip package structure | — | 2008-08-05 |
| 7335982 | Chip package structure and chip packaging process | Chin-Li KAO, Yi-Shao Lai, Tong-Hong Wang | 2008-02-26 |
| 7199479 | Chip package structure and process for fabricating the same | — | 2007-04-03 |
| 7042078 | Semiconductor package | — | 2006-05-09 |
| 6972489 | Flip chip package with thermometer | Ching-Hsu Yang | 2005-12-06 |