Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368412 | Receiving module, packaging structure, printed circuit board, and electronic device | Qinghua Huang | 2025-07-22 |
| 11179770 | Electromagnetic semi-continuous casting device and method having accurately matched and adjusted cooling process | Qichi LE, Yonghui Jia, Lei Bao, Jian Hou, Jiashi Yan | 2021-11-23 |
| 11059244 | Method of making a composite structure | Alexander Douglas Fergusson, Alexander George Newman, Adam Paul Leon Mayall, Teodor Boykov Balev, Jonathan Philip Casey +1 more | 2021-07-13 |
| 10780678 | Composite sandwich structure | Alexander Douglas Fergusson, Alexander George Newman, Adam Paul Leon Mayall, Teodor Boykov Balev, Jonathan Philip Casey +1 more | 2020-09-22 |
| 8022534 | Semiconductor package using an active type heat-spreading element | Chang-Chi Lee | 2011-09-20 |
| 7482204 | Chip packaging process | Chin-Li KAO, Yi-Shao Lai, Jeng-Da Wu | 2009-01-27 |
| 7335982 | Chip package structure and chip packaging process | Chin-Li KAO, Yi-Shao Lai, Jeng-Da Wu | 2008-02-26 |
| 7259456 | Heat dissipation apparatus for package device | — | 2007-08-21 |