Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7446409 | Cavity-down multiple-chip package | — | 2008-11-04 |
| 7224057 | Thermal enhance package with universal heat spreader | — | 2007-05-29 |
| 6972489 | Flip chip package with thermometer | Jeng-Da Wu | 2005-12-06 |