| 8288853 |
Three-dimensional package and method of making the same |
Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Jian-Wen Lo +1 more |
2012-10-16 |
$520,000 |
| 7741152 |
Three-dimensional package and method of making the same |
Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Jian-Wen Lo +1 more |
2010-06-22 |
$1,742,000 |
| 7642132 |
Three-dimensional package and method of making the same |
Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Jian-Wen Lo +1 more |
2010-01-05 |
$1,401,000 |
| 7528053 |
Three-dimensional package and method of making the same |
Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Jian-Wen Lo +1 more |
2009-05-05 |
$1,763,000 |
| 7446404 |
Three-dimensional package and method of making the same |
Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Jian-Wen Lo +1 more |
2008-11-04 |
$135,000 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Min-Lung Huang, Chi-Long Tsai, Chao-Fu Weng |
2007-08-07 |
$302,000 |
| 7064428 |
Wafer-level package structure |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2006-06-20 |
$948,000 |
| 6989326 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2006-01-24 |
$927,000 |
| 6967153 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-11-22 |
$218,000 |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-08-09 |
$450,000 |
| 6921716 |
Wafer bumping process |
Min-Lung Huang, Chi-Long Tsai, Chao-Fu Weng |
2005-07-26 |
$313,000 |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-04-12 |
$183,000 |
| 6875683 |
Method of forming bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2005-04-05 |
$545,000 |
| 6861346 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2005-03-01 |
$202,000 |
| 6846719 |
Process for fabricating wafer bumps |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-01-25 |
$464,000 |
| 6827252 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-12-07 |
$129,000 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-06-29 |
$394,000 |
| 6743707 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-06-01 |
$687,000 |
| 6732912 |
Solder ball attaching process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-05-11 |
$679,000 |
| 6723630 |
Solder ball fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-04-20 |
$326,000 |
| 6720244 |
Bump fabrication method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-04-13 |
$495,000 |
| 6716739 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-04-06 |
$349,000 |
| 6713320 |
Bumping process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-03-30 |
$268,000 |
| 6673711 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-01-06 |
$696,000 |
| 6664128 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +4 more |
2003-12-16 |
$1,223,000 |