Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183593 | Manufacturing method for manufacturing a package structure | Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu, Cyuan-Hong Shih, Yen-Liang Chen | 2024-12-31 |
| 12027469 | Electronic device package and method of manufacturing the same | En Hao HSU, Kuo-Hwa Tzeng, Chia-Pin Chen | 2024-07-02 |
| 11798859 | Electronic device package and method of manufacturing the same | Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu | 2023-10-24 |
| 7501311 | Fabrication method of a wafer structure | — | 2009-03-10 |
| 7473998 | Method for forming bump protective collars on a bumped wafer | — | 2009-01-06 |
| 7432188 | Structure of bumps forming on an under metallurgy layer and method for making the same | Wan-Huei Lu | 2008-10-07 |
| 7402510 | Etchant and method for forming bumps | En-Chieh Wu, Hiew Watt Ng, Hui-Hung Chen | 2008-07-22 |
| 7261828 | Bumping process | En-Chieh Wu, Chao-Fu Weng, Min-Lung Huang, Chia-Ming Chuang | 2007-08-28 |
| 7253519 | Chip packaging structure having redistribution layer with recess | Min-Lung Huang, Chao-Fu Weng, Ching-Huei Su | 2007-08-07 |
| 7129111 | Method for forming bump protective collars on a bumped wafer | — | 2006-10-31 |
| 7105433 | Method for treating wafer surface | Min-Lung Huang | 2006-09-12 |
| 7041590 | Formation method for conductive bump | Tsung-Yen Tseng, Zhi-Hao Chen | 2006-05-09 |
| 7015130 | Method for making UBM pads and bumps on wafer | Min-Lung Huang, Chao-Fu Weng, En-Chieh Wu, Yang Hong-Zen | 2006-03-21 |
| 6921716 | Wafer bumping process | Min-Lung Huang, Chao-Fu Weng, Ching-Huei Su | 2005-07-26 |