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Manufacturing method for manufacturing a package structure |
Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu, Cyuan-Hong Shih, Yen-Liang Chen |
2024-12-31 |
| 12027469 |
Electronic device package and method of manufacturing the same |
En Hao HSU, Kuo-Hwa Tzeng, Chia-Pin Chen |
2024-07-02 |
| 11798859 |
Electronic device package and method of manufacturing the same |
Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu |
2023-10-24 |
| 7501311 |
Fabrication method of a wafer structure |
— |
2009-03-10 |
| 7473998 |
Method for forming bump protective collars on a bumped wafer |
— |
2009-01-06 |
| 7432188 |
Structure of bumps forming on an under metallurgy layer and method for making the same |
Wan-Huei Lu |
2008-10-07 |
| 7402510 |
Etchant and method for forming bumps |
En-Chieh Wu, Hiew Watt Ng, Hui-Hung Chen |
2008-07-22 |
| 7261828 |
Bumping process |
En-Chieh Wu, Chao-Fu Weng, Min-Lung Huang, Chia-Ming Chuang |
2007-08-28 |
| 7253519 |
Chip packaging structure having redistribution layer with recess |
Min-Lung Huang, Chao-Fu Weng, Ching-Huei Su |
2007-08-07 |
| 7129111 |
Method for forming bump protective collars on a bumped wafer |
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2006-10-31 |
| 7105433 |
Method for treating wafer surface |
Min-Lung Huang |
2006-09-12 |
| 7041590 |
Formation method for conductive bump |
Tsung-Yen Tseng, Zhi-Hao Chen |
2006-05-09 |
| 7015130 |
Method for making UBM pads and bumps on wafer |
Min-Lung Huang, Chao-Fu Weng, En-Chieh Wu, Yang Hong-Zen |
2006-03-21 |
| 6921716 |
Wafer bumping process |
Min-Lung Huang, Chao-Fu Weng, Ching-Huei Su |
2005-07-26 |