Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9955590 | Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same | — | 2018-04-24 |
| 8431007 | Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the same | Shin-Luh TARNG | 2013-04-30 |
| 8288854 | Semiconductor package and method for making the same | Yi-Ting Wu | 2012-10-16 |
| 7581666 | Wire-bonding method for wire-bonding apparatus | Ho-Ming Tong, Teck-Chong Lee, Chian-Chi Lin, Chih-Nan Wei, Song-Fu Yang +2 more | 2009-09-01 |
| 7547575 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Ho-Ming Tong, Kao-Ming Su, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai +2 more | 2009-06-16 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chian-Chi Lin, Che-Ya Chou, Shin-Hua Chao +2 more | 2008-11-04 |
| 7261828 | Bumping process | En-Chieh Wu, Chi-Long Tsai, Min-Lung Huang, Chia-Ming Chuang | 2007-08-28 |
| 7253519 | Chip packaging structure having redistribution layer with recess | Min-Lung Huang, Chi-Long Tsai, Ching-Huei Su | 2007-08-07 |
| 7144801 | Bumping process to increase bump height | — | 2006-12-05 |
| 7064428 | Wafer-level package structure | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2006-06-20 |
| 7015130 | Method for making UBM pads and bumps on wafer | Chi-Long Tsai, Min-Lung Huang, En-Chieh Wu, Yang Hong-Zen | 2006-03-21 |
| 6989326 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more | 2006-01-24 |
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-11-22 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-08-09 |
| 6921716 | Wafer bumping process | Min-Lung Huang, Chi-Long Tsai, Ching-Huei Su | 2005-07-26 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-04-12 |
| 6875683 | Method of forming bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more | 2005-04-05 |
| 6867122 | Redistribution process | — | 2005-03-15 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-01-25 |
| 6827252 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more | 2004-12-07 |
| 6812124 | Chip structure with bumps and a process for fabricating the same | — | 2004-11-02 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-06-29 |
| 6743707 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more | 2004-06-01 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-05-11 |