| 8059422 |
Thermally enhanced package structure |
Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more |
2011-11-15 |
| 7614888 |
Flip chip package process |
Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more |
2009-11-10 |
| 7538421 |
Flip-chip package structure with stiffener |
— |
2009-05-26 |
| 7064428 |
Wafer-level package structure |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2006-06-20 |
| 6989326 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +2 more |
2006-01-24 |
| 6967153 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2005-11-22 |
| 6939790 |
Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder |
Su Tao |
2005-09-06 |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2005-08-09 |
| 6908842 |
Bumping process |
Su Tao |
2005-06-21 |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2005-04-12 |
| 6875683 |
Method of forming bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +2 more |
2005-04-05 |
| 6861346 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +3 more |
2005-03-01 |
| 6846719 |
Process for fabricating wafer bumps |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2005-01-25 |
| 6827252 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +2 more |
2004-12-07 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2004-06-29 |
| 6743707 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +3 more |
2004-06-01 |
| 6732912 |
Solder ball attaching process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2004-05-11 |
| 6723630 |
Solder ball fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +3 more |
2004-04-20 |
| 6720244 |
Bump fabrication method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2004-04-13 |
| 6716739 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +2 more |
2004-04-06 |
| 6713320 |
Bumping process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2004-03-30 |
| 6673711 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +3 more |
2004-01-06 |
| 6664128 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +4 more |
2003-12-16 |
| 6617237 |
Lead-free bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Ching-Huei Su +5 more |
2003-09-09 |