Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10775373 | Method for enhancement of the uniform reaction on the porous materials | An-Bang Wang, Shih-Chung Chang, Yi Jiang, Yi-Kuang Yen | 2020-09-15 |
| 8889488 | Method for manufacturing semiconductor package | Shin-Hua Chao, Hui-Ying Hsieh, Chih-Ming Chung | 2014-11-18 |
| 8546950 | Semiconductor package and manufacturing method thereof | Shin-Hua Chao, Hui-Ying Hsieh, Chih-Ming Chung | 2013-10-01 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Yung-Cheng Huang +3 more | 2011-11-15 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Yung-Cheng Huang +3 more | 2009-11-10 |