Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11474301 | Device for communication | Chang-Feng You, Jr-Wei LIN, Chieh-Chen Fu, Chen Yuan Weng | 2022-10-18 | $1,703,000 |
| 7581666 | Wire-bonding method for wire-bonding apparatus | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Chih-Nan Wei +2 more | 2009-09-01 | $2,457,000 |
| 7547575 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Ho-Ming Tong, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai +2 more | 2009-06-16 | $811,000 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou +2 more | 2008-11-04 |