Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7402510 | Etchant and method for forming bumps | Hiew Watt Ng, Hui-Hung Chen, Chi-Long Tsai | 2008-07-22 |
| 7261828 | Bumping process | Chao-Fu Weng, Chi-Long Tsai, Min-Lung Huang, Chia-Ming Chuang | 2007-08-28 |
| 7015130 | Method for making UBM pads and bumps on wafer | Chi-Long Tsai, Min-Lung Huang, Chao-Fu Weng, Yang Hong-Zen | 2006-03-21 |