Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2003-09-09 |
| 6265768 | Chip scale package | Su Tao | 2001-07-24 |
| 6221697 | Chip scale package and manufacturing method thereof | Chih-Chang Yang, Shyh-Wei Wang, Chih-Sien Yeh | 2001-04-24 |