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Home › Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates

Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates

US Patent 8836116 · Granted Sep 16, 2014

Estimated economic value: $3,239,000 ⓘ

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