Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8000107 | Carrier with embedded component and method for fabricating the same | Yung-Hui Wang, Chih-Pin Hung | 2011-08-16 |
| 7586184 | Electronic package | Chih-Pin Hung, Chi-Tsung Chiu, Yung-Hui Wang | 2009-09-08 |
| 7256480 | Lead frame package structure with high density of lead pins arrangement | Chih-Pin Hung | 2007-08-14 |
| 7060595 | Circuit substrate and fabrication method thereof | Chih-Pin Hung, Chia-Shang Chen, Kuang-Hua Lin, Shin-Hua Chao | 2006-06-13 |
| 6750397 | Thermally enhanced semiconductor build-up package | Yi Ding, Kun-Ching Chen | 2004-06-15 |
| 6701614 | Method for making a build-up package of a semiconductor | Yi Ding, Kun-Ching Chen | 2004-03-09 |
| 6680529 | Semiconductor build-up package | Kun-Ching Chen, Yi Ding | 2004-01-20 |