Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7727818 | Substrate process for an embedded component | Li-Cheng Tai | 2010-06-01 |
| 7651937 | Bumping process and structure thereof | Li-Cheng Tai, Shyh-Ing Wu, Shih-Kuang Chen | 2010-01-26 |
| 7541273 | Method for forming bumps | Li-Cheng Tai | 2009-06-02 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Li-Cheng Tai, Jui-I Yu, Jiunn Chen, Shyh-Ing Wu, Shih-Kuang Chen +2 more | 2009-04-14 |