Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816252 | Method for forming bumps on under bump metallurgy | Li-Cheng Tai | 2010-10-19 |
| 7800240 | Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure | — | 2010-09-21 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Li-Cheng Tai, Jiunn Chen, Chueh-An Hsieh, Shyh-Ing Wu, Shih-Kuang Chen +2 more | 2009-04-14 |