Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8222726 | Semiconductor device package having a jumper chip and method of fabricating the same | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ming-Hsiang Cheng | 2012-07-17 | $563,000 |
| 7696060 | Recyclable stamp device and recyclable stamp process for wafer bond | Meng-Jen Wang | 2010-04-13 | $1,174,000 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Li-Cheng Tai, Jui-I Yu, Chueh-An Hsieh, Shyh-Ing Wu, Shih-Kuang Chen +2 more | 2009-04-14 | $1,389,000 |