HC

Hsiao-Chuan Chang

AE Advanced Semiconductor Engineering: 14 patents #83 of 1,073Top 8%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
Overall (All Time): #297,447 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9618191 Light emitting package and LED bulb Tsung-Yueh Tsai 2017-04-11
8865106 Composite raw material, carbon fiber material and method for forming the same Tun-Fun Way, Yu-Ting Chen, Jiun-Jy Chen 2014-10-21
8421242 Semiconductor package Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Ming-Hsiang Cheng 2013-04-16
8368216 Semiconductor package Yi-Shao Lai, Tsung-Yueh Tsai, Ming-Kun Chen, Ming-Hsiang Cheng 2013-02-05
8274149 Semiconductor device package having a buffer structure and method of fabricating the same Tsung-Yueh Tsai, Yi-Shao Lai, Ming-Hsiang Cheng 2012-09-25
8222726 Semiconductor device package having a jumper chip and method of fabricating the same Tsung-Yueh Tsai, Yi-Shao Lai, Jiunn Chen, Ming-Hsiang Cheng 2012-07-17
8222733 Semiconductor device package Ming-Hsiang Cheng, Yi-Shao Lai, Tsung-Yueh Tsai 2012-07-17
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Chien-Wen Chen, Yi-Shao Lai, Tsung-Yueh Tsai, Pao-Huei Chang Chien, Ping Hu +1 more 2012-02-14
8110931 Wafer and semiconductor package Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +6 more 2012-02-07
8076786 Semiconductor package and method for packaging a semiconductor package Chang Ying Hung, Tsung-Yueh Tsai, Yi-Shao Lai, Jian-Cheng Chen, Wei Chi Yih +1 more 2011-12-13
8072064 Semiconductor package and method for making the same Yi-Shao Lai, Tsung-Yueh Tsai, Ming-Kun Chen, Ming-Hsiang Cheng 2011-12-06
8053906 Semiconductor package and method for processing and bonding a wire Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +3 more 2011-11-08
8018075 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +1 more 2011-09-13
7980757 Bonding strength measuring device Yi-Shao Lai, Tsung-Yueh Tsai 2011-07-19
7964949 Tenon-and-mortise packaging structure Yi-Shao Lai, Tsung-Yueh Tsai, Tsan-Hsien Chen 2011-06-21
5643518 Process for preparing fibers of soluble wholly aromatic polyamides Jen-Chang Yang, Jin-Chyueh Lin, Lien-Tai Chen 1997-07-01