{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Recyclable stamp device and recyclable stamp process for wafer bond", "item": "https://www.patentleaderboard.com/patent/7696060"}]}
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Home › Recyclable stamp device and recyclable stamp process for wafer bond

Recyclable stamp device and recyclable stamp process for wafer bond

US Patent 7696060 · Granted Apr 13, 2010

Estimated economic value: $1,174,000 ⓘ

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