Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816252 | Method for forming bumps on under bump metallurgy | Jui-I Yu | 2010-10-19 |
| 7727818 | Substrate process for an embedded component | Chueh-An Hsieh | 2010-06-01 |
| 7651937 | Bumping process and structure thereof | Chueh-An Hsieh, Shyh-Ing Wu, Shih-Kuang Chen | 2010-01-26 |
| 7541273 | Method for forming bumps | Chueh-An Hsieh | 2009-06-02 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Jui-I Yu, Jiunn Chen, Chueh-An Hsieh, Shyh-Ing Wu, Shih-Kuang Chen +2 more | 2009-04-14 |
| 7472197 | Method and apparatus for automatic switching of multicast/unicast live TV streaming in a TV-over-IP environment | Qiang Li, Naxin Wang | 2008-12-30 |
| 6577333 | Automatic multi-camera video composition | Boon-Lock Yeo, Minerva M. Yeung | 2003-06-10 |