Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7523551 | Manufacturing method of a multi-layer circuit board embedded with a passive component | Yung-Hui Wang | 2009-04-28 |
| 7338892 | Circuit carrier and manufacturing process thereof | Yung-Hui Wang | 2008-03-04 |
| 7112523 | Bumping process | — | 2006-09-26 |
| 7091121 | Bumping process | — | 2006-08-15 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Shih-Kuang Chen, Shyh-Ing Wu +5 more | 2004-02-17 |