Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6737300 | Chip scale package and manufacturing method | Yi Ding, Kun-Ching Chen | 2004-05-18 | $332,000 |
| 6455941 | Chip scale package | Yi Ding, Kun-Ching Chen | 2002-09-24 | $894,000 |