Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Chun-Hung Lin, Su Tao, Kun-Ching Chen | 2003-03-18 | $430,000 |