Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616007 | Electronic package | You-Lung Yen, Bernd Karl Appelt | 2023-03-28 |
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | You-Lung Yen, Bernd Karl Appelt | 2022-10-04 |
| 8487426 | Semiconductor package with embedded die and manufacturing methods thereof | Bernd Karl Appelt, Ming-Chiang Lee | 2013-07-16 |