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USPTO Patent Rankings Data through Dec 31, 2025
Home › Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. › Dror Hurwitz
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Dror Hurwitz — 52 Patents

ZCZhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co.: 24 patents #1 of 5Top 20%
ZCZhuhai Crystal Resonance Technologies Co.: 15 patents #1 of 5Top 20%
ATAmitec-Advanced Multilayer Interconnect Technoloiges: 6 patents #1 of 9Top 15%
ZCZhuhai Access Semiconductor Co.: 2 patents #9 of 20Top 45%
Zhuhai, CN: #4 of 854 inventorsTop 1%
Overall (All Time): #50,240 of 4,157,543Top 2%
52 Patents All Time
Dror Hurwitz has been granted 52 US patents while listed as an inventor at Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co.. The first was granted in 1999 and the most recent in November 2025. Dror Hurwitz ranks #50,240 of 4,157,543 US inventors in our database (top 1.2%). Patent records list Dror Hurwitz in Zhuhai, CN.

Patents per Year

Patents granted per year, 1999 to 2025Bar chart with a peak of 7 patents in 2015.peak 71999: 1 patents19992001: 3 patents2009: 1 patents20092010: 2 patents2014: 2 patents20142015: 7 patents2016: 6 patents20162017: 6 patents2018: 5 patents20182019: 7 patents2020: 5 patents20202021: 1 patents2022: 2 patents20222025: 4 patents2025

Issued Patents All Time

Showing 1–25 of 52 patents

Patent #TitleCo-InventorsDate
12476605 Packaged electronic components BawChing Perng, Duan Feng 2025-11-18
12445104 FBAR filter with trap rich layer — 2025-10-14
12381534 Film bulk acoustic wave resonator with bifurcated electrode Zhihui Fu, Weiqiang Hu 2025-08-05
12316302 Hybrid band-pass filter with integrated passive device and acoustic resonator Chuanxiang DAI, Ming Tian 2025-05-27
11463063 Method for packaging an electronic component in a package with an organic back end BawChing Perng, Duan Feng 2022-10-04
11245383 Packages with organic back ends for electronic components BawChing Perng, Duan Feng 2022-02-08
11063571 Packaged electronic components BawChing Perng, Duan Feng 2021-07-13
10797681 Method of fabricating novel packages for electronic components BawChing Perng, Duan Feng 2020-10-06
10779417 Substrates with ultra fine pitch flip chip bumps Alex Huang 2020-09-15
10771031 Method for fabricating single crystal piezoelectric RF resonators and filters with improved cavity definition — 2020-09-08
10630259 Single crystal piezoelectric RF resonators and filters with improved cavity definition — 2020-04-21
10601397 RF resonator electrode and membrane combinations and method of fabrication — 2020-03-24
10508364 RF resonator membranes and methods of construction — 2019-12-17
10466572 Method of fabrication for single crystal piezoelectric RF resonators and filters — 2019-11-05
10446335 Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor Alex Huang 2019-10-15
10439581 Method for fabricating RF resonators and filters — 2019-10-08
10439580 Method for fabricating RF resonators and filters — 2019-10-08
10389331 Single crystal piezoelectric RF resonators and filters — 2019-08-20
10236854 Multilayer electronic structures with embedded filters Alex Huang 2019-03-19
10153750 RF resonators and filters — 2018-12-11
10141912 RF resonators and filters — 2018-11-27
10014843 Multilayer electronic structures with embedded filters Alex Huang 2018-07-03
9949373 Interposer frame with polymer matrix and methods of fabrication Alex Huang 2018-04-17
9911700 Embedded packages Alex Huang 2018-03-06
9779940 Chip package Alex Huang 2017-10-03

Frequent Collaborators

Alex Huang20 shared
Eva Igner7 shared
Duan Feng5 shared
BawChing Perng5 shared
Dror Katz4 shared
Boris Yofis4 shared

Nearby-Ranked Inventors

Sungbum Kim52
Douglas C. La Tulipe, Jr.52
Jan-Gerard Cornelis Van Der Toorn52
Masanori Ohara52
Katherine Morgenroth52
Dae Ho LEE52
Serg Bell52
Masahiro Nakagawa52
Yun Fang52