Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9615447 | Multilayer electronic support structure with integral constructional elements | Alex Huang | 2017-04-04 |
| 9589920 | Chip package | Alex Huang | 2017-03-07 |
| 9554469 | Method of fabricating a polymer frame with a rectangular array of cavities | Alex Huang | 2017-01-24 |
| 9440135 | Multilayer electronic structures with integral vias extending in in-plane direction | — | 2016-09-13 |
| 9374059 | Film bulk acoustic resonator filter | Alex Huang | 2016-06-21 |
| 9349788 | Thin film capacitors embedded in polymer dielectric | Alex Huang | 2016-05-24 |
| 9312593 | Multilayer electronic structure with novel transmission lines | — | 2016-04-12 |
| 9269593 | Multilayer electronic structure with integral stepped stacked structures | — | 2016-02-23 |
| 9240392 | Method for fabricating embedded chips | Alex Huang | 2016-01-19 |
| 9185793 | Multilayer electronic structure with through thickness coaxial structures | Simon S. Chan, Alex Huang | 2015-11-10 |
| 9161461 | Multilayer electronic structure with stepped holes | Simon S. Chan, Alex Huang | 2015-10-13 |
| 9137905 | Alignment between layers of multilayer electronic support structures | Simon S. Chan | 2015-09-15 |
| 9049791 | Terminations and couplings between chips and substrates | Alex Huang | 2015-06-02 |
| 8997342 | Method of fabrication, a multilayer electronic structure and structures in accordance with the method | Alex Huang | 2015-04-07 |
| 8987602 | Multilayer electronic support structure with cofabricated metal core | Alex Huang | 2015-03-24 |
| 8945994 | Single layer coreless substrate | Shih-Fu Huang | 2015-02-03 |
| 8866286 | Single layer coreless substrate | Shih-Fu Huang, Xianming Chen Simon Chan | 2014-10-21 |
| 8816218 | Multilayer electronic structures with vias having different dimensions | — | 2014-08-26 |
| 7682972 | Advanced multilayer coreless support structures and method for their fabrication | Mordechay Farkash, Eva Igner, Boris Statnikov, Benny Michaeli | 2010-03-23 |
| 7669320 | Coreless cavity substrates for chip packaging and their fabrication | Mordechay Farkash, Eva Igner, Boris Statnikov, Benny Michaeli | 2010-03-02 |
| 7635641 | Integrated circuit support structures and their fabrication | Mardechay Farkash, Eva Igner, Amit Zeidler, Boris Statnikov, Benny Michaeli | 2009-12-22 |
| 6280640 | Process for manufacturing a chip carrier substrate | Boris Yofis, Dror Katz, Eva Igner | 2001-08-28 |
| 6262376 | Chip carrier substrate | Boris Yofis, Dror Katz, Eva Igner | 2001-07-17 |
| 6262478 | Electronic interconnect structure and method for manufacturing it | Eva Igner, Boris Yofis, Dror Katz | 2001-07-17 |
| 5946600 | Method for manufacturing an electronic structure | Eva Igner, Boris Yofis, Dror Katz | 1999-08-31 |