Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069169 | System and method for remotely controlling locks on depositories | — | 2021-07-20 |
| 10779417 | Substrates with ultra fine pitch flip chip bumps | Dror Hurwitz | 2020-09-15 |
| 10446335 | Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor | Dror Hurwitz | 2019-10-15 |
| 10236854 | Multilayer electronic structures with embedded filters | Dror Hurwitz | 2019-03-19 |
| 10014843 | Multilayer electronic structures with embedded filters | Dror Hurwitz | 2018-07-03 |
| 9949373 | Interposer frame with polymer matrix and methods of fabrication | Dror Hurwitz | 2018-04-17 |
| 9911700 | Embedded packages | Dror Hurwitz | 2018-03-06 |
| 9779940 | Chip package | Dror Hurwitz | 2017-10-03 |
| 9673063 | Terminations | Dror Hurwitz | 2017-06-06 |
| 9642261 | Composite electronic structure with partially exposed and protruding copper termination posts | Dror Hurwitz | 2017-05-02 |
| 9615447 | Multilayer electronic support structure with integral constructional elements | Dror Hurwitz | 2017-04-04 |
| 9589920 | Chip package | Dror Hurwitz | 2017-03-07 |
| 9554469 | Method of fabricating a polymer frame with a rectangular array of cavities | Dror Hurwitz | 2017-01-24 |
| 9374059 | Film bulk acoustic resonator filter | Dror Hurwitz | 2016-06-21 |
| 9349788 | Thin film capacitors embedded in polymer dielectric | Dror Hurwitz | 2016-05-24 |
| 9240392 | Method for fabricating embedded chips | Dror Hurwitz | 2016-01-19 |
| 9185793 | Multilayer electronic structure with through thickness coaxial structures | Dror Hurwitz, Simon S. Chan | 2015-11-10 |
| 9161461 | Multilayer electronic structure with stepped holes | Dror Hurwitz, Simon S. Chan | 2015-10-13 |
| 9049791 | Terminations and couplings between chips and substrates | Dror Hurwitz | 2015-06-02 |
| 8997342 | Method of fabrication, a multilayer electronic structure and structures in accordance with the method | Dror Hurwitz | 2015-04-07 |
| 8987602 | Multilayer electronic support structure with cofabricated metal core | Dror Hurwitz | 2015-03-24 |
| 7884013 | Dual damascene with via liner | Uway Tseng, Kun-Szu Liu | 2011-02-08 |
| 7387961 | Dual damascene with via liner | Uway Tseng, Kun-Szu Liu | 2008-06-17 |
| 7347705 | Adapter for a fluorescent tube | David Tsai | 2008-03-25 |
| 7168976 | Soft PC board connector | — | 2007-01-30 |