Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463063 | Method for packaging an electronic component in a package with an organic back end | Dror Hurwitz, Duan Feng | 2022-10-04 |
| 11245383 | Packages with organic back ends for electronic components | Dror Hurwitz, Duan Feng | 2022-02-08 |
| 11063571 | Packaged electronic components | Dror Hurwitz, Duan Feng | 2021-07-13 |
| 10797681 | Method of fabricating novel packages for electronic components | Dror Hurwitz, Duan Feng | 2020-10-06 |