Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8330267 | Semiconductor package | Kuang-Hsiung Chen, Pao-Ming Hsieh, Shih-Fu Huang, Bernd Karl Appelt | 2012-12-11 |
| 8320134 | Embedded component substrate and manufacturing methods thereof | Shih-Fu Huang, Ming-Chiang Lee, Chien-Hao Wang | 2012-11-27 |
| 8309400 | Leadframe package structure and manufacturing method thereof | Bernd Karl Appelt, Kay Stefan Essig, Chun-Che Lee, Kuang-Hsiung Chen | 2012-11-13 |
| 8288869 | Semiconductor package with substrate having single metal layer and manufacturing methods thereof | Shih-Fu Huang, Chia-Cheng Chen, Kuang-Hsiung Chen, Ming-Chiang Lee, Bernd Karl Appelt +1 more | 2012-10-16 |
| 8284561 | Embedded component package structure | Shih-Fu Huang, Bernd Karl Appelt, Ming-Chiang Lee | 2012-10-09 |
| 8104171 | Method of fabricating multi-layered substrate | Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen | 2012-01-31 |
| 6353997 | Layer build-up method for manufacturing multi-layer board | — | 2002-03-12 |