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Portable battery detection device |
Dao-Qin Lin, Shih-Chang Tseng, Chih-Hsien Chung, Gwo-Huei You, Kuo-Kuang Jen |
2023-06-13 |
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Safety protection device and method for battery test system |
Chih-Hsien Chung, Gwo-Huei You, Kuo-Kuang Jen |
2023-05-23 |
| 11169212 |
External battery short-circuit testing device |
Shih-Chang Tseng, Kuo-Kuang Jen, Gwo-Huei You, Chih-Hsien Chung |
2021-11-09 |
| 10594143 |
Charging method for battery set and battery management system using the same |
Jeng-Chyan Lin, Kuo-Kuang Jen, Fu-Min Fang |
2020-03-17 |
| 10536020 |
Charging control apparatus, charging control method and computer readable medium thereof |
Hsun-Ming Hsien, Kuo-Kuang Jen, Gwo-Huei You, Jung-Zong Wu |
2020-01-14 |
| 10404527 |
Link reestablishment method and electrical system using the same |
Jeng-Chyan Lin, Kuo-Kuang Jen, Fu-Min Fang |
2019-09-03 |
| 10377262 |
Range extending apparatus for electric vehicle and control method thereof |
Kuo-Kuang Jen, Jeng-Chyan Lin, Hsun-Ming Hsien, Fu-Min Fang |
2019-08-13 |
| 10063070 |
Battery active balancing system |
Kuo-Kuang Jen, Jeng-Chyan Lin, Hsun-Ming Hsien, Fu-Min Fang |
2018-08-28 |
| 9929078 |
Semiconductor package structure and method for manufacturing the same |
Wen-Long LU, Chi-Chang Lee, Yuan-Feng Chiang |
2018-03-27 |
| 8975157 |
Carrier bonding and detaching processes for a semiconductor wafer |
— |
2015-03-10 |
| 8865520 |
Carrier bonding and detaching processes for a semiconductor wafer |
Kuo-Pin Yang, Cheng-Hui Hung |
2014-10-21 |
| 8194896 |
Packaging structure and method of a MEMS microphone |
— |
2012-06-05 |
| 8053367 |
Wafer polishing method |
— |
2011-11-08 |
| 7829961 |
MEMS microphone package and method thereof |
— |
2010-11-09 |
| 7808060 |
MEMS microphone module and method thereof |
— |
2010-10-05 |
| 7674688 |
Sawing method for a semiconductor element with a microelectromechanical system |
— |
2010-03-09 |
| 7573124 |
Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same |
Meng-Jen Wang, Kuo-Pin Yang, Sheng-Yang Peng |
2009-08-11 |
| 7563652 |
Method for encapsulating sensor chips |
Kuo-Pin Yang |
2009-07-21 |
| 7560744 |
Package optical chip with conductive pillars |
Kuo-Pin Yang |
2009-07-14 |
| 7238590 |
Package structure of semiconductor and wafer-level formation thereof |
Kuo-Pin Yang |
2007-07-03 |
| 6700178 |
Package of a chip with beveled edges |
Jian-Cheng Chen |
2004-03-02 |