Wei-Min Hsiao — 21 Patents at Advanced Semiconductor Engineering

Wei-Min Hsiao has been granted 21 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2004 and the most recent in June 2023. Wei-Min Hsiao ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Wei-Min Hsiao in Taoyuan, TW.

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11675018	Portable battery detection device	Dao-Qin Lin, Shih-Chang Tseng, Chih-Hsien Chung, Gwo-Huei You, Kuo-Kuang Jen	2023-06-13
11658370	Safety protection device and method for battery test system	Chih-Hsien Chung, Gwo-Huei You, Kuo-Kuang Jen	2023-05-23
11169212	External battery short-circuit testing device	Shih-Chang Tseng, Kuo-Kuang Jen, Gwo-Huei You, Chih-Hsien Chung	2021-11-09
10594143	Charging method for battery set and battery management system using the same	Jeng-Chyan Lin, Kuo-Kuang Jen, Fu-Min Fang	2020-03-17
10536020	Charging control apparatus, charging control method and computer readable medium thereof	Hsun-Ming Hsien, Kuo-Kuang Jen, Gwo-Huei You, Jung-Zong Wu	2020-01-14
10404527	Link reestablishment method and electrical system using the same	Jeng-Chyan Lin, Kuo-Kuang Jen, Fu-Min Fang	2019-09-03
10377262	Range extending apparatus for electric vehicle and control method thereof	Kuo-Kuang Jen, Jeng-Chyan Lin, Hsun-Ming Hsien, Fu-Min Fang	2019-08-13
10063070	Battery active balancing system	Kuo-Kuang Jen, Jeng-Chyan Lin, Hsun-Ming Hsien, Fu-Min Fang	2018-08-28
9929078	Semiconductor package structure and method for manufacturing the same	Wen-Long LU, Chi-Chang Lee, Yuan-Feng Chiang	2018-03-27	$2,277,000
8975157	Carrier bonding and detaching processes for a semiconductor wafer	—	2015-03-10	$5,724,000
8865520	Carrier bonding and detaching processes for a semiconductor wafer	Kuo-Pin Yang, Cheng-Hui Hung	2014-10-21	$1,084,000
8194896	Packaging structure and method of a MEMS microphone	—	2012-06-05	$596,000
8053367	Wafer polishing method	—	2011-11-08	$965,000
7829961	MEMS microphone package and method thereof	—	2010-11-09	$413,000
7808060	MEMS microphone module and method thereof	—	2010-10-05	$717,000
7674688	Sawing method for a semiconductor element with a microelectromechanical system	—	2010-03-09	$2,169,000
7573124	Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same	Meng-Jen Wang, Kuo-Pin Yang, Sheng-Yang Peng	2009-08-11	$2,075,000
7563652	Method for encapsulating sensor chips	Kuo-Pin Yang	2009-07-21	$1,982,000
7560744	Package optical chip with conductive pillars	Kuo-Pin Yang	2009-07-14	$940,000
7238590	Package structure of semiconductor and wafer-level formation thereof	Kuo-Pin Yang	2007-07-03	$1,052,000
6700178	Package of a chip with beveled edges	Jian-Cheng Chen	2004-03-02	$380,000

Wei-Min Hsiao — 21 Patents

Issued Patents All Time

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