Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699654 | Electronic device package and method of manufacturing the same | Chih-Yi Huang, Ping Shen | 2023-07-11 |
| 10453764 | Molding for large panel fan-out package | Po-Wei LU, Ming Tsung Shen, Yu-Tzu Peng | 2019-10-22 |
| 10211161 | Semiconductor package structure having a protection layer | Yuan-Feng Chiang, Cong Chen, I-Ting Chi | 2019-02-19 |