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AE Advanced Semiconductor Engineering: 40 patents #12 of 1,073Top 2%
PC Phoenix Pioneer Technology Co.: 1 patents #17 of 24Top 75%
Overall (All Time): #77,287 of 4,157,543Top 2%
40
Patents All Time

Issued Patents All Time

Showing 26–40 of 40 patents

Patent #TitleCo-InventorsDate
11322468 Semiconductor device including metal holder and method of manufacturing the same Bernd Karl Appelt 2022-05-03
11322454 Semiconductor device packages and method of manufacturing the same Bernd Karl Appelt 2022-05-03
11282777 Semiconductor package and method of manufacturing the same Bernd Karl Appelt 2022-03-22
11145624 Semiconductor device package and method for manufacturing the same Bernd Karl Appelt, Kay Stefan Essig 2021-10-12
10978312 Semiconductor device package and method of manufacturing the same Bernd Karl Appelt, Kay Stefan Essig 2021-04-13
10755994 Semiconductor package structure and semiconductor substrate 2020-08-25
10643863 Semiconductor package and method of manufacturing the same Kuang-Hsiung Chen, Shing-Cheng Liang, Pei-Yu Hsu 2020-05-05
10217728 Semiconductor package and semiconductor process Bernd Karl Appelt, Kay Stefan Essig 2019-02-26
10181438 Semiconductor substrate mitigating bridging Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee 2019-01-15
10128198 Double side via last method for double embedded patterned substrate Chih-Cheng Lee, Yuan-Chang Su 2018-11-13
10079156 Semiconductor package including dielectric layers defining via holes extending to component pads Chih-Cheng Lee, Yuan-Chang Su, Yu-Lin Shih 2018-09-18
9659853 Double side via last method for double embedded patterned substrate Chih-Cheng Lee, Yuan-Chang Su 2017-05-23
9583427 Semiconductor substrate, semiconductor package structure and method of making the same Chih-Cheng Lee, Yuan-Chang Su, Cheng-Lin Ho, Chung-Ming Wu 2017-02-28
9373601 Semiconductor substrate, semiconductor package structure and method of making the same Chih-Cheng Lee, Yuan-Chang Su, Cheng-Lin Ho, Chung-Ming Wu 2016-06-21
8104171 Method of fabricating multi-layered substrate Bernd Karl Appelt, Yuan-Chang Su, Ming-Chiang Lee 2012-01-31