PC

Pao-Hung Chou

PC Phoenix Pioneer Technology Co.: 23 patents #3 of 24Top 15%
UT Unimicron Technology: 5 patents #62 of 284Top 25%
PT Phoenix Precision Technology: 2 patents #17 of 42Top 45%
AE Advanced Semiconductor Engineering: 1 patents #625 of 1,073Top 60%
📍 Hukou, TW: #2 of 17 inventorsTop 15%
Overall (All Time): #123,310 of 4,157,543Top 3%
30
Patents All Time

Issued Patents All Time

Showing 26–30 of 30 patents

Patent #TitleCo-InventorsDate
9093459 Package structure having a semiconductor component embedded therein and method of fabricating the same Chih-Hao Hsu 2015-07-28
8222528 Circuit board structure for electrical testing and fabrication method thereof 2012-07-17
7786571 Heat-conductive package structure Chi-Liang Chu, Wei Wang 2010-08-31
7627946 Method for fabricating a metal protection layer on electrically connecting pad of circuit board 2009-12-08
7378345 Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof 2008-05-27