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Chi-Liang Chu

UT Unimicron Technology: 1 patents #166 of 284Top 60%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,301,005 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7786571 Heat-conductive package structure Pao-Hung Chou, Wei Wang 2010-08-31