Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2024-11-26 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2022-10-18 |
| 10483232 | Method for fabricating bump structures on chips with panel type process | Shih-Ping Hsu, Che-Wei Hsu | 2019-11-19 |
| 8067696 | Printed circuit board and method for manufacturing same | Chung-Jen Tsai, Chia-Cheng Chen, Hung-Yi Chang, Cheng-Hsien Lin | 2011-11-29 |
| 7799603 | Method for mounting electronic component on printed circuit board | Chung-Jen Tsai, Chia-Cheng Chen, Hung-Yi Chang, Cheng-Hsien Lin | 2010-09-21 |