Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422481 | Semiconductor chip and sequence checking circuit | Bi-Yang Li, Shih-Cheng Kao | 2025-09-23 |
| 12404398 | Resin composition | Te-Chao Liao, Wei-Ru Huang, Chia-Lin Liu | 2025-09-02 |
| 12398226 | Resin composition | Te-Chao Liao, Wei-Ru Huang, Chia-Lin Liu, HungFan Lee | 2025-08-26 |
| 12378407 | Resin composition | Te-Chao Liao, Chien Kai Wei | 2025-08-05 |
| 12365753 | Rubber resin material with high thermal conductivity and high dielectric constant and metal substrate using the same | Te-Chao Liao, Hao-Sheng Chen, Chia-Lin Liu | 2025-07-22 |
| 12356562 | Portable controller with replaceable module | — | 2025-07-08 |
| 12283957 | Interface device and signal transceiving method thereof | Bi-Yang Li, Igor Elkanovich, Shih-Cheng Kao | 2025-04-22 |
| 12117864 | Interface device and signal transceiving method thereof | Bi-Yang Li, Igor Elkanovich, Shih-Cheng Kao | 2024-10-15 |
| 12077667 | Resin composition | Te-Chao Liao, Chien Kai Wei | 2024-09-03 |
| 11920036 | Rubber resin material with high dielectric constant | Te-Chao Liao, Chien Kai Wei, Chia-Lin Liu | 2024-03-05 |
| 11903127 | Fluoride-based resin prepreg and circuit substrate using the same | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang | 2024-02-13 |
| 11900953 | Audio processing device and audio processing method | Chun-Chang Liu, Jing-Chu Chan | 2024-02-13 |
| 11890832 | Prepreg and metallic clad laminate | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Chia-Lin Liu | 2024-02-06 |
| 11869846 | Interposer routing structure and semiconductor package | Sheng-Fan Yang, Hao-Yu Tung, Wei-Chiao WANG, Yi-Tzeng LIN | 2024-01-09 |
| 11859083 | Low-dielectric rubber resin material and low-dielectric metal substrate | Te-Chao Liao, Chia-Lin Liu, Chien Kai Wei | 2024-01-02 |
| 11639420 | Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board | Te-Chao Liao, Hao-Sheng Chen, Chi-Lin Chen | 2023-05-02 |
| 11515278 | Communication interface structure between processing die and memory die | Wei-Chieh Liao, Igor Elkanovich, Li-Ken Yeh, Chung-Ling Liou | 2022-11-29 |
| 11270545 | Coin dispenser | Chia-Min Chang, Dong Yang | 2022-03-08 |
| 11057070 | Signal receiving device adapting to signal input mode and signal processing method for the same | Chen-Kang Lin, Bing-Juo Chuang | 2021-07-06 |
| 11051402 | Fluorine-containing substrate, copper clad laminate, and printed circuit board | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang | 2021-06-29 |
| 11008451 | Fluorocarbon prepreg and resin composition thereof | Te-Chao Liao, Ying-Te Huang, Chih-Kai Chang, Hao-Sheng Chen, Chia-Lin Liu | 2021-05-18 |
| 10916852 | Antenna device capable of generating specific radiation pattern | Chih-Shen Chou, Tsung-Shou Yeh, Hsiang-Cheng Yang | 2021-02-09 |
| 10895007 | Evaporation apparatus and calibration method thereof | Yu-Lin Hsu, Chien-Hung Lin, Kuo-Hsin Huang, Chao-Feng Sung, Chih-Ming Lai | 2021-01-19 |
| 10889741 | Fluorocarbon resin composition and prepreg and copper foil substrate using the same | Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang | 2021-01-12 |
| 10781297 | Thermosetting resin composition | Te-Chao Liao, Ying-Te Huang, Hao-Sheng Chen, Chia-Lin Liu | 2020-09-22 |