Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869846 | Interposer routing structure and semiconductor package | Sheng-Fan Yang, Hung-Yi Chang, Wei-Chiao WANG, Yi-Tzeng LIN | 2024-01-09 |
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Yu-Cheng Sun, Ming-Hsuan WANG, Igor Elkanovich | 2023-03-07 |