Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Hao-Yu Tung, Yu-Cheng Sun, Igor Elkanovich | 2023-03-07 |
| 10453803 | Wiring substrate having alternating ground and signal lines in a plurality of wiring layers | Ting Wang, Yen-Chih Chiu | 2019-10-22 |