Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600572 | Routing structure between dies and method for arranging routing between dies | Wei-Chieh Liao, Hao-Yu Tung, Ming-Hsuan WANG, Igor Elkanovich | 2023-03-07 |
| 11335631 | Power delivery device and method | Sheng-Fan Yang, Yuan-Hung Lin, Hung-Chang Kuo, Yung-Yang Liang | 2022-05-17 |
| 11309936 | Signal transmission device | Sheng-Fan Yang, Yuan-Hung Lin, Yung-Yang Liang | 2022-04-19 |
| 10892238 | Circuit structure and chip package | Yuan-Hung Lin, Sheng-Fan Yang | 2021-01-12 |
| 10790223 | Integrated circuit package element and load board thereof | Sheng-Fan Yang, Yuan-Hung Lin, Steve S. A. Wan | 2020-09-29 |
| 10736209 | Circuit board structure and conductive transmission line structure thereof | Sheng-Fan Yang, Yuan-Hung Lin | 2020-08-04 |