Issued Patents All Time
Showing 25 most recent of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347919 | Semiconductor package antenna structure and its manufacturing method | Che-Wei Hsu | 2025-07-01 |
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo | 2024-11-26 |
| 12094922 | Inductance traces protected through shielding layers | Pao-Hung Chou, Chun-Hsien Yu | 2024-09-17 |
| 12062685 | Inductor structure having conductive sheets having fan plate shape arranged in ring structure and fabrication method thereof, electronic package and fabrication method thereof, and method for fabricating packaging carrier | — | 2024-08-13 |
| 11757426 | Manufacturing method for surface acoustic wave filter package structure | Che-Wei Hsu | 2023-09-12 |
| 11749612 | Semiconductor package device | Chun-Hsien Yu, Hsien-Ming Tsai | 2023-09-05 |
| 11658104 | Intermediate substrate and fabrication method thereof | Chu-Chin Hu, Pao-Hung Chou | 2023-05-23 |
| 11552014 | Semiconductor package structure and method of making the same | Che-Wei Hsu, Chao-Tsung Tseng | 2023-01-10 |
| 11488911 | Flip-chip package substrate | Chu-Chin Hu | 2022-11-01 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo | 2022-10-18 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Chun-Hsien Yu | 2022-09-20 |
| 11417581 | Package structure | Chin-Wen Liu, Tang-I Wu, Shu-Wei Hu | 2022-08-16 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Chun-Hsien Yu, Wen-Chang Chen | 2022-08-02 |
| 11387806 | Surface acoustic wave filter package structure and method of manufacturing the same | Che-Wei Hsu | 2022-07-12 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu | 2022-05-17 |
| 11246223 | Package apparatus | — | 2022-02-08 |
| 11222880 | Package structure for semiconductor device and manufacturing method thereof | Che-Wei Hsu | 2022-01-11 |
| 11183447 | Flip-chip package substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu | 2021-11-23 |
| 11139230 | Flip-chip package substrate and method for preparing the same | Pao-Hung Chou, Chun-Hsien Yu | 2021-10-05 |
| 11081435 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2021-08-03 |
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2021-06-08 |
| 10896882 | Electronic package having heat dissipating element and method for fabricating the same | Che-Wei Hsu, Chih-Kuai Yang | 2021-01-19 |
| 10784205 | Electronic package | Chu-Chin Hu | 2020-09-22 |
| 10745818 | Method of fabricating package substrates | Chun-Hsien Yu, Pao-Hung Chou | 2020-08-18 |
| 10580739 | Package substrate and associated fabrication method with varying depths for circuit device terminals | Chu-Chin Hu | 2020-03-03 |