Shih-Ping Hsu — 167 Patents at Phoenix Precision Technology

Shih-Ping Hsu has been granted 167 US patents while listed as an inventor at Phoenix Precision Technology. The first was granted in 2002 and the most recent in July 2025. Shih-Ping Hsu ranks #4,975 of 4,157,543 US inventors in our database (top 0.12%). Patent records list Shih-Ping Hsu in Dashulong, TW.

Issued Patents All Time

Showing 1–25 of 167 patents

Patent #	Title	Co-Inventors	Date
12347919	Semiconductor package antenna structure and its manufacturing method	Che-Wei Hsu	2025-07-01
12154866	Method of fabricating a flip-chip package core substrate with build-up layers	Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo	2024-11-26
12094922	Inductance traces protected through shielding layers	Pao-Hung Chou, Chun-Hsien Yu	2024-09-17
12062685	Inductor structure having conductive sheets having fan plate shape arranged in ring structure and fabrication method thereof, electronic package and fabrication method thereof, and method for fabricating packaging carrier	—	2024-08-13
11757426	Manufacturing method for surface acoustic wave filter package structure	Che-Wei Hsu	2023-09-12
11749612	Semiconductor package device	Chun-Hsien Yu, Hsien-Ming Tsai	2023-09-05
11658104	Intermediate substrate and fabrication method thereof	Chu-Chin Hu, Pao-Hung Chou	2023-05-23
11552014	Semiconductor package structure and method of making the same	Che-Wei Hsu, Chao-Tsung Tseng	2023-01-10
11488911	Flip-chip package substrate	Chu-Chin Hu	2022-11-01
11476204	Flip-chip packaging substrate and method for fabricating the same	Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo	2022-10-18
11450597	Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same	Pao-Hung Chou, Chun-Hsien Yu	2022-09-20
11417581	Package structure	Chin-Wen Liu, Tang-I Wu, Shu-Wei Hu	2022-08-16
11404348	Semiconductor package carrier board, method for fabricating the same, and electronic package having the same	Pao-Hung Chou, Chun-Hsien Yu, Wen-Chang Chen	2022-08-02
11387806	Surface acoustic wave filter package structure and method of manufacturing the same	Che-Wei Hsu	2022-07-12
11335630	Semiconductor package substrate, electronic package and methods for fabricating the same	Pao-Hung Chou, Chun-Hsien Yu	2022-05-17
11246223	Package apparatus	—	2022-02-08
11222880	Package structure for semiconductor device and manufacturing method thereof	Che-Wei Hsu	2022-01-11
11183447	Flip-chip package substrate and method for fabricating the same	Pao-Hung Chou, Chun-Hsien Yu	2021-11-23
11139230	Flip-chip package substrate and method for preparing the same	Pao-Hung Chou, Chun-Hsien Yu	2021-10-05
11081435	Package substrate and flip-chip package circuit including the same	Che-Wei Hsu	2021-08-03
11031329	Method of fabricating packaging substrate	Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang	2021-06-08
10896882	Electronic package having heat dissipating element and method for fabricating the same	Che-Wei Hsu, Chih-Kuai Yang	2021-01-19
10784205	Electronic package	Chu-Chin Hu	2020-09-22
10745818	Method of fabricating package substrates	Chun-Hsien Yu, Pao-Hung Chou	2020-08-18
10580739	Package substrate and associated fabrication method with varying depths for circuit device terminals	Chu-Chin Hu	2020-03-03

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Shih-Ping Hsu — 167 Patents

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