Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418989 | Packaged circuit structure | Chun-Chieh Huang | 2025-09-16 |
| 11683888 | Method for manufacturing a packaged circuit structure | Chun-Chieh Huang | 2023-06-20 |
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2021-06-08 |
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2018-06-19 |
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2017-11-28 |
| 9805996 | Substrate structure and manufacturing method thereof | Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2017-10-31 |
| 9583436 | Package apparatus and manufacturing method thereof | Chao-Tsung Tseng, Shih-Ping Hsu, Che-Wei Hsu | 2017-02-28 |
| 8354598 | Packaging substrate and fabrication method thereof | — | 2013-01-15 |
| 8168513 | Method for fabricating packaging substrate | — | 2012-05-01 |