Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272653 | Semiconductor packaging substrate and manufacturing method thereof | Che-Wei Hsu | 2025-04-08 |
| 11552014 | Semiconductor package structure and method of making the same | Che-Wei Hsu, Shih-Ping Hsu | 2023-01-10 |
| 9806012 | IC carrier of semiconductor package and manufacturing method thereof | Shih-Ping Hsu | 2017-10-31 |
| 9583436 | Package apparatus and manufacturing method thereof | Shih-Ping Hsu, Chin-Ming Liu, Che-Wei Hsu | 2017-02-28 |