Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2021-06-08 |
| 10896882 | Electronic package having heat dissipating element and method for fabricating the same | Shih-Ping Hsu, Che-Wei Hsu | 2021-01-19 |
| 10062649 | Package substrate | Shih-Ping Hsu | 2018-08-28 |
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2018-06-19 |
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2017-11-28 |
| 9805996 | Substrate structure and manufacturing method thereof | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2017-10-31 |