Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658104 | Intermediate substrate and fabrication method thereof | Shih-Ping Hsu, Pao-Hung Chou | 2023-05-23 |
| 11488911 | Flip-chip package substrate | Shih-Ping Hsu | 2022-11-01 |
| 11031329 | Method of fabricating packaging substrate | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2021-06-08 |
| 10784205 | Electronic package | Shih-Ping Hsu | 2020-09-22 |
| 10580739 | Package substrate and associated fabrication method with varying depths for circuit device terminals | Shih-Ping Hsu | 2020-03-03 |
| 10204865 | Electronic package and conductive structure thereof | Shih-Ping Hsu | 2019-02-12 |
| 10079220 | Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding | Shih-Ping Hsu | 2018-09-18 |
| 10002823 | Packaging substrate and method of fabricating the same | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2018-06-19 |
| 9831217 | Method of fabricating package substrates | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-11-28 |
| 9754982 | Packaging module and substrate structure thereof | Chun-Hsien Yu, Shih-Ping Hsu | 2017-09-05 |
| 9613894 | Electronic package | Shih-Ping Hsu | 2017-04-04 |
| 9601402 | Package apparatus and manufacturing method thereof | E-Tung Chou, Shih-Ping Hsu | 2017-03-21 |
| 9589935 | Package apparatus and manufacturing method thereof | Shih-Ping Hsu, E-Tung Chou | 2017-03-07 |
| 9357647 | Packaging substrate, method for manufacturing same, and chip packaging body having same | Shih-Ping Hsu, E-Tung Chou, Chih-Jen Hsiao | 2016-05-31 |
| 8531021 | Package stack device and fabrication method thereof | Shih-Ping Hsu, Yi-Ju Chen | 2013-09-10 |
| 8354338 | Carrier board structure with embedded semiconductor chip and fabrication method thereof | Shang-Wei Chen | 2013-01-15 |
| 8222080 | Fabrication method of package structure | — | 2012-07-17 |
| 7417299 | Direct connection multi-chip semiconductor element structure | — | 2008-08-26 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof | Shih-Ping Hsu | 2008-01-15 |
| 7190592 | Integrated library core for embedded passive components and method for forming electronic device thereon | — | 2007-03-13 |
| 7112524 | Substrate for pre-soldering material and fabrication method thereof | Shih-Ping Hsu | 2006-09-26 |
| 6576541 | Method and structure for producing bumps on an IC package substrate | — | 2003-06-10 |