Issued Patents All Time
Showing 26–50 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483232 | Method for fabricating bump structures on chips with panel type process | Che-Wei Hsu, Tung-Yao Kuo | 2019-11-19 |
| 10483194 | Interposer substrate and method of fabricating the same | Pao-Hung Chou | 2019-11-19 |
| 10475752 | Semiconductor package structure and method of making the same | Che-Wei Hsu | 2019-11-12 |
| 10475765 | Interposer substrate and method for manufacturing the same | Che-Wei Hsu, Ching-Chieh Chang, Chao-Chung Tseng | 2019-11-12 |
| 10361160 | Package structure and its fabrication method | — | 2019-07-23 |
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Pao-Hung Chou, Chi-Feng Peng | 2019-07-09 |
| 10283442 | Interposer substrate and method of fabricating the same | Che-Wei Hsu | 2019-05-07 |
| 10269841 | Sensor package and method of manufacturing the same | Che-Wei Hsu | 2019-04-23 |
| 10204865 | Electronic package and conductive structure thereof | Chu-Chin Hu | 2019-02-12 |
| 10117340 | Manufacturing method of package substrate with metal on conductive portions | Che-Wei Hsu, Pao-Hung Chou | 2018-10-30 |
| 10079220 | Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding | Chu-Chin Hu | 2018-09-18 |
| 10079190 | Methods of fabricating an electronic package structure | Chin-Wen Liu, Tang-I Wu, Shu-Wei Hu | 2018-09-18 |
| 10062649 | Package substrate | Chih-Kuai Yang | 2018-08-28 |
| 10014242 | Interposer substrate and method of fabricating the same | Pao-Hung Chou | 2018-07-03 |
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2018-06-19 |
| 9992879 | Package substrate with metal on conductive portions and manufacturing method thereof | Che-Wei Hsu, Pao-Hung Chou | 2018-06-05 |
| 9972599 | Package structure and method of manufacturing the same | Chao-Chung Tseng | 2018-05-15 |
| 9941208 | Substrate structure and manufacturing method thereof | — | 2018-04-10 |
| 9905503 | Package stucture and method of fabricating the same | Chao-Chung Tseng | 2018-02-27 |
| 9893003 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2018-02-13 |
| 9831165 | Interposer substrate and method of manufacturing the same | Che-Wei Hsu, Chih-Wen Liu | 2017-11-28 |
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-11-28 |
| 9824964 | Package substrate, package structure including the same, and their fabrication methods | Chun-Hsien Yu | 2017-11-21 |
| 9805996 | Substrate structure and manufacturing method thereof | Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-10-31 |
| 9806012 | IC carrier of semiconductor package and manufacturing method thereof | Chao-Tsung Tseng | 2017-10-31 |